Designs of Eddy Current Sensor Probes Based on Multilayer Printed Circuit Board Technology

Kai Zhang; Xing Jian Dai; Xiao Zhang Zhang

doi:10.4028/www.scientific.net/AMM.190-191.801

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 190-191Designs of Eddy Current Sensor Probes Based on...

Designs of Eddy Current Sensor Probes Based on Multilayer Printed Circuit Board Technology

Abstract:

Probe characteristics are important for eddy current displacement sensors. Probes made by multilayer printed circuit board (PCB) are good at maintaining quality consistency and their axial length was short. As design principles for wired probes were not suitable for PCB probes, an analysis and design method for them was developed. In this paper, PCB probe characteristics were first analyzed with 3D eddy current field FEM software. The process was time-consuming. To increase analysis efficiency, a simplified 2D axial symmetry model was used to replace the 3D model. The analysis results were compared and their difference was small. The probe resister and inductance were compared with measurement result of a test PCB probe and they agreed well. Based on 2D model, a series of analysis was performed and basic design principles for PCB probes were obtained. Based on the principles, a new PCB probe with better performance was designed.

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Periodical:

Applied Mechanics and Materials (Volumes 190-191)

Pages:

801-805

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.190-191.801

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Online since:

July 2012

Authors:

Kai Zhang, Xing Jian Dai, Xiao Zhang Zhang

Keywords:

Eddy Current Sensor, Finite Element Method (FEM), PCB

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