Study of the Machining Principle and Influencing of ELID Grinding on SiC

Qiang Xiao

doi:10.4028/www.scientific.net/AMM.217-219.1642

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Study of the Machining Principle and Influencing of ELID Grinding on SiC
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 217-219Study of the Machining Principle and Influencing...

Study of the Machining Principle and Influencing of ELID Grinding on SiC

Abstract:

The hardness of SiC single crystal is very closer to that of diamond, which makes it greatly difficult to process SiC single crystal. It is usually machined by lapping, but this technique requires a long machining time, resulting in low productivity, So we examine the possibility of ELID grinding in SiC single crystal. Results show that with the use of ELID, mirror surfaces can be achieved with high efficiency.

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Periodical:

Applied Mechanics and Materials (Volumes 217-219)

Pages:

1642-1645

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.217-219.1642

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Online since:

November 2012

Authors:

Qiang Xiao

Keywords:

ELID Grinding, Material Removal, Oxide Layer, Surface Quality

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