Simulation of Temperature Field and Thermal Stress Field during Laser Drilling

Xue Jun Chen; Qi Liu

doi:10.4028/www.scientific.net/AMM.217-219.2226

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 217-219Simulation of Temperature Field and Thermal Stress...

Simulation of Temperature Field and Thermal Stress Field during Laser Drilling

Abstract:

In this paper, the finite element simulation of laser drilling process has been carried out for the nickel alloy DD6. Both the transient temperature field and thermal stress field were computed via the commercial software package ANSYS. Based on the method of dimensional analysis, the dependence of various non-dimensional parameters on both fields was specified and demonstrated in graphical forms.

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Periodical:

Applied Mechanics and Materials (Volumes 217-219)

Pages:

2226-2229

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.217-219.2226

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Online since:

November 2012

Authors:

Xue Jun Chen, Qi Liu

Keywords:

Dimensional Analysis, Laser Drilling, Temperature Field, Thermal Stress Field

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References

[1] M.L. Cao, Study on the laser processing of quartz glass holes, Hunan University, 2007．

Google Scholar

[2] J.Q. Cai, Laminated plate using laser drilling, Printed circuit information 5 (2001) 49-52.

Google Scholar

[3] L. Gao, The group of small holes of stainless steel pipe in the laser processing technology, J. Weifang Univ. 7 (2007) 40-42.

Google Scholar

[4] L.Tunnaa, W. O'Neilla, Analysis of laser micro drilled holes through aluminum for micro-manufacturing applications, Opt. Lasers Eng. 43 (2005) 937-950.

DOI: 10.1016/j.optlaseng.2004.11.001

Google Scholar

[5] X.D. Wang, A. Michalowski, D. Walter, S. Sommer, Laser drilling of stainless steel with nanosecond double-pulse, Opt. Laser Technol. 41 (2009) 148-153.

DOI: 10.1016/j.optlastec.2008.05.021

Google Scholar

[6] M. Sunar, B.S. Yilbas, K. Boran, Thermal and stress analysis of a sheet metal in welding, J. Mater. Processing Technol. 172 (2006) 123-129.

DOI: 10.1016/j.jmatprotec.2005.09.008

Google Scholar

[7] B.S. Yilbas, N. Al-Aqeeli, Analytical investigation into laser pulse heating and thermal stresses, Opt. Laser Technol. 41 (2009) 132- 139.

DOI: 10.1016/j.optlastec.2008.05.016

Google Scholar

[8] J.K. Jiao, X.B. Wang, H. Lu, Analysis of temperature and stress field of Quartz glass under laser, Laser technol. 31 (2007) 427-430.

Google Scholar

[9] W.J. Zhou, Y. H., Y.Z. Gui, Study thermal effect of TiO2/SiO2 thin films via pulsed laser irradiation, High power laser and particle beams, 19 (2007) 23-26.

Google Scholar

[10] S. Dharani, M. Pradip, Finite element analysis of laser irradiated metal heating and melting processes, Opt. Laser Technol. 42 (2010) 855-865.

DOI: 10.1016/j.optlastec.2009.11.022

Google Scholar

[11] C.Z. Yuan, C.F. Xue, Finite element analysis of temperature field in laser rapid forming process and simulation, Mech. Design, 19 (2002) 104-107.

Google Scholar