Thermal Design and Thermal Analysis of Control Cabinet for Pattern Sewing Machine

Abstract:

Thermal design and thermal analysis of control cabinet for pattern sewing machine was researched to make components’ temperature meets the requirement. Basic flow sheet of research process was introduced. Then, preliminary thermal design and thermal analysis was performed, and the computed result indicated that temperature of some components was out of limit. Next, by optimizing the location of fan and components in cabinet, the temperature of servo driver 1 to 3 dropped 11.1 oC, 10.8 oC and 11.3 oC respectively. The data shows that cabinet’s heat dissipation is improved, and the thermal design of the cabinet is reasonable. Finally, Thermal test of the prototype was performed, which proves the thermal design is effective, and the numerical simulation result is correct.

• Periodical: Applied Mechanics and Materials (Volumes 217-219)
• Pages: 2467-2472
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.217-219.2467
• Online since: November 2012
• Authors: Qi Bing Li, Yu Huang
• Keywords: Control Cabinet, Optimization Design, Pattern Sewing Machine, Thermal Analysis, Thermal Design

References

[1] Kailong Zhang, Ke Liang, Xingshe Zhou. Design and simulation of embedded system in pattern sewing machine.aeronautical computing technique,2007, 37(3), P. 48-53.

[2] Xiaodong Xi. Research and development of new type embedded software in pattern sewing machine. Xi'an, School of Computer Science of Northwestern Polytechnical University, 2005.

[3] Zhou Lu, Kailong Zhang, Yuan Yao. Design and implementation of pattern style generating algorithm for intelligent pattern sewing machine. Computer Technology and Development.2011, 21(8), P. 18-21.

[4] DerenXie.The reviewof thermal designfor electronic Equipment. ElectronicsMachineryEngineering,1999, (1), P. 26-28.

[5] S.Moghaddam, M.Rada, A. Shooshtari.Evaluation of analytical models for thermal analysis and design of electronic packages. Microelectronics Journal, 2003, 34, P. 223-230.

DOI: 10.1016/s0026-2692(02)00192-1

[6] Jesse E.Galloway. Thermal Analysis of Portable Electronic Products. Inter-Society Conference on Thermal Phenomena. 1998, P. 1-7.

[7] Anming Liu, Qiuxia Dong, Shuo Cheng. Investigation on thermal design for opening cabinet of electronic equipment by numerical simulation. Journal of Air Force Engineering University. 2005, 6(2), pp.62-65.

[8] Liheng Chen, ShuyanXu. Thermal design of electric cabinet for high-resolution space camera. Optics and Precision Engineering, 2011, 19(1), P. 69-76.