Age-Hardening Characteristics of Cu-Ni-Si Alloy after Cold Deformation

Article Preview

Abstract:

The microstructural features and heat treatment response of Cu-2.1Ni-0.5Si-0.2Zr-0.05Cr (wt.%) alloy have been investigated. The alloy was aged at 400°C、450°C and 500°C after a cold deformation of 70% reduction. The variation in hardness and electrical conductivity of the alloy was measured as a function of aging time. The results indicated the highest peak hardness value of approximately 205HV for the alloy aged at 400°C for 4h after the solution treatment and cold deformation. The alloy has two main phases, one is Ni2Si phase, and the other is Cr2Zr phase. The strengthening mechanisms of the alloy include spinodal decomposition strengthening, ordering strengthening and precipitation strengthening.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

294-298

Citation:

Online since:

November 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Yuwen CAO, Jusheng MA XiangyunTANG.: The Chinese Journal of Nonferrous Metals.(In Chinese). Vol. 9(1999), pp.769-776.

Google Scholar

[2] Shuisheng Xie, Yanli Li, Zhu Li: RARE METALS (In Chinese). Vol. 27 (2003), pp.769-776.

Google Scholar

[3] OKYER S A, NOBLE FW. J Mater Sci. Vol29(1994), pp.218-226.

Google Scholar

[4] Rensei F: Journal of the Japan Copper and Brass Research Association. Vol.36 (1997), pp.25-32.

Google Scholar

[5] FUJIWARA H, KAMIO A: Journal of Japan Institute of Metals. Vol. 62(1998), pp.301-309.

Google Scholar

[6] R.J.GRYLLS,C.D.S.TUCK: Scripta Mater. Vol.43 (1996), pp.121-126.

Google Scholar

[7] CORSON M G: Electrical World. Vol.89 (1927), pp.137-139.

Google Scholar

[8] Lockyer S A, Noble F W: Materials Science and Technolog. Vol.15 (1999), pp.1147-1153.

Google Scholar

[9] Dongmei ZHAO, Qiming DONG, LIU Ping: Transactions of Nonferrous Metals Society of China (In Chinese). Vol. 13 (2003), pp.258-261.

Google Scholar

[10] Young G Kim, Tae Y Seong, Jae H. Hah, Alan J Ardell: Journal of Materials Science. Vol. 21 (1986), pp.1357-1362.

Google Scholar

[11] Young G Kim, Chung Ryu: Semiconductor International. Vol. 8 (1985), pp.250-253.

Google Scholar

[12] Dongfeng Wang, Buxi Kang, Liu Ping: Ordnance Material Science and Engineering (In Chinese). Vol.26 (2003), pp.8-10.

Google Scholar

[13] Dongfeng Wang, Buxi Kang, Liu Ping: Journal of Henan University of Science and Technology (In Chinese). Vol.24 (2003), pp.1-3.

Google Scholar

[14] V.C. Srivastava, A. Schneider, V. Uhenwinkel: Journal of Materials Processing Technology. Vol.147 (2004), pp.174-180.

Google Scholar

[15] V.C. Srivastava, A. Schneider, V. Uhenwinkel: Materials Science and Technology. Vol.20 (2004), pp.839-848.

Google Scholar