Electrochemical Behavior of Copper in the (NaCl-KCl-CuCl₂) Molten Salt

Abstract:

2 system at 700°C. The results showed that so long as Cu appears or the electrodeposit process carries on, Cu++ can be reduced into Cu⁺; that the electrochemical reaction process of copper is a quasi-reversible process mix-controlled by ion copper diffusion rate and electron transport rate; that the electrochemical reaction mechanism is Cu⁺+e-→Cu; that the electrocrystallization process of copper is an instantaneous hemispheroid three-dimensional nucleation process; that the Cu ion diffusion coefficient is 2.5×10^-4cm²∙s^-1 at experimental conditions.

• Periodical: Applied Mechanics and Materials (Volumes 217-219)
• Pages: 8-14
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.217-219.8
• Online since: November 2012
• Authors: Yun Gang Li, Kuai Zhang, Jie Li, Li Min Liu
• Keywords: Copper, Electrochemical Reduction Mechanism, Electrocrystallization Process, NaCl-KCl-CuCl₂

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