A Novel Method for POP Stacking Warpage

Abstract:

With the miniaturization of portable products, integrate circuit becomes thinner, the effect of warpage on Package-on-Package (POP) stacking assemble on integrate circuit have become more distinct. It will lead to the deformation of the chip substrate and the more serious effectiveness of the solder joint. Consequently, in this paper, a novel method by adding fixed metal pillars in the middle of POP stacking substrates can well suppress warpage problems caused by the uneven heating reflow materials. Finally, this new method is feasible by analyzing the stress of warp model.

• Periodical: Applied Mechanics and Materials (Volumes 217-219)
• Pages: 826-829
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.217-219.826
• Online since: November 2012
• Authors: Ling Feng Shi, Chen Meng, Yuan Ming Xiao, Li Ye Cheng, Cheng Shan Cai, Xin Quan Lai
• Keywords: Ball Grid Array (BGA), Package-on-Package (POP), Solder Joint, Warpage

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