Thermal Analysis of CUBESAT in Worse Case Hot and Cold Environment Using FEA Method

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One of the necessary parts of CubeSat’s design is the thermal analysis. It will provide the operating temperatures and their distribution for all devices inside the CubeSat. For decision, which temperature standard can be used for components it is necessary to know the maximum and the minimum value of the temperature. In virtue of these results the position of the all devices must be also optimized. Some methods of the thermal control are also proposed. Contrary to most subsystems the thermal subsystem is not independent of the others. All elements in the spacecraft have an influence on the thermal housekeeping by either emitting or absorbing energy or both respectively. The objective of thermal subsystem is to ensure that the spacecraft operate within the spacecraft operating temperature range. There are two types of thermal control technique; passive and active. Due to the size and power constraint of CubeSat, passive thermal control will be more suitable but analysis must be done in order to know that passive control is sufficient. The FEA methodology would be utilized in order to determine the spacecraft operating temperature within the range. To accomplish this, MSC Nastran Patran software will be used as the FEA modeling tool. The MD Patran will act as preprocessing tool whereas MD Nastran will act as post processing tool. If the simulated thermal range is deviates, temperature sensors and heaters will be mounted on the CubeSat to monitor the deviation. Alternatively, mounting Kapton tape onto the CubeSat structure and laying gold coating would be another method to maintain the desired temperature range. The design of the thermal system shall be based on passive methods. This approach is vital to avoid power consumption in cases where it would not be necessary. As conclusion the thermal subsystem is designed to operate the spacecraft throughout its mission phases without any failure.

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497-502

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November 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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