Analysis of LDMOS for Effect of Fingers, Device-Width and Inductance (Load) on Reverse Recovery

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This work demonstrates the effect of fingers, device-width and inductance on reverse recovery of LDMOS by unclamped inductive switching (UIS) circuit simulation for two dimensional (2D) and three dimensional (3D) devices. All the observations have been done for maximum pulse width at which device pass under UIS test. For UIS simulations the failure criteria is taken as the device temperature reaching a critical value of 650K. It has been shown that reverse recovery charge (Qrr) increased linearly with number of fingers, device width and inductance.

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2077-2081

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November 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] Z. Jing, Q. Qiusong, S. Weifeng and L. Siyang in: Analysis of trigger behavior of high voltage LDMOS under TLP and VFTLP stress, Journal of Semiconductor vol. 31 (2010).

DOI: 10.1088/1674-4926/31/1/014003

Google Scholar

[2] R. Boylestad and L. Nashelsky: Electronic Devices And Circuit Theory (Prentice Hall, 2002).

Google Scholar

[3] M. T. Rahimo, N. Y. A. Shammas in: Freewheeling Diode Reverse Recovery Failure Modes in IGBT Applications, IEEE Trans (2001) Vol. 37, p.661.

DOI: 10.1109/28.913734

Google Scholar

[4] P. H. Aaen, J. Wood, Q. Li and E. Mares in: Thermal Résistance Modeling for the Electrothermal Layout of High-Power RF Transistor. IEEE (2010), p.1672.

DOI: 10.1109/mwsym.2010.5518198

Google Scholar

[5] N. Agarwala, K. N. Sharma, J. R. Tsai, Adarsh B, G. Sheu and S. M. Yang in : Effect of Finger and Device-Width on Ruggedness of nLDMOS Device under Single-Pulse Unclamped Inductive Switching (UIS) Conditions , ECS Trans (2012) Vol. 44, p.1123.

DOI: 10.1149/1.3694438

Google Scholar

[6] N. Agarwala, K. N. Sharma, J. R. Tsai, G. Sheu and S. M. Yang in: Optimization of nLDMOS Ruggedness under Unclamped Inductive Switching (UIS) Stress Conditions by Poly-Gate Extension, ECS Trans (2012) Vol. 44 p.127.

DOI: 10.1149/1.3694306

Google Scholar

[7] T. Sugiyama, S. Yamazaki, S. Nakagaki and M. Ishiko in: A study of correlation between traps and reverse-recovery characteristics of FWDs, IEEE ISPSD (2005). Power Semiconductor Device and ICs, p.243.

DOI: 10.1109/ispsd.2005.1487996

Google Scholar

[8] K. Nishiwaki, T. Kushida, and A. Kawahashi in: A Fast & Soft Recovery Diodes with Ultra small Qrr (USQ-Diode) Using Local Lifetime Control by He Ion Irradiation. ISPSD (2001) p.235.

DOI: 10.1109/ispsd.2001.934598

Google Scholar

[9] R. R. Stoltenbury in: Boundary of Power MOSFET, Unclamped Inductive Switching (UIS), and Avalanche Current Capability, IEEE Applied Power Electronics Conferences (1989), p.359.

DOI: 10.1109/apec.1989.36987

Google Scholar

[10] F. Chimento, S. Musumeci, A. Raciti, S. Sannino, A. Magri, M. Melito, and F. Zara in: Robustness Evaluation of MOSFETs by Equivalent Cell Behavioral Model of the Gate Parasitic Resistance, IEEE IAS (2007), p.350.

DOI: 10.1109/07ias.2007.48

Google Scholar