Shear Ram Height Characterization for Copper Wire Bond Shear Test

Z. Sauli; V. Retnasamy; A. H. M. Shapri; N. A. Z. Rahman; W.M.W. Norhaimi; S. Taniselass; R. Vairavan

doi:10.4028/www.scientific.net/AMM.229-231.674

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 229-231Shear Ram Height Characterization for Copper Wire...

Shear Ram Height Characterization for Copper Wire Bond Shear Test

Abstract:

The work here investigates the height effect during a shearing process of a copper ball bond in a wire bond. Finite element analysis was used to investigate this analysis.The effects of the shear ram height on the stress and strain response of the copper ball bond were investigated. The results obtained hows there is a significant effect of the shear height to the Von Mises stress and equivalent strain response to the copper ball bond during the shearing simulation.