Simulation Research on Bonded Microchannel Deformation of Polymer Microfluidic Chip

Lei Huang; Zhang Wang; Chun Peng Chu; Bing Yan Jiang

doi:10.4028/www.scientific.net/AMM.246-247.1204

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 246-247Simulation Research on Bonded Microchannel...

Simulation Research on Bonded Microchannel Deformation of Polymer Microfluidic Chip

Abstract:

A new bonding method of microfluidic chips, bonding in-mold, was presented. Finite element software simulation was used to study the deformation of microchannels in poly methyl methacrylate (PMMA) bonded chips. Varied temperature and compression thickness have been taken into account. Results showed that bonded microchannel cannot maintain the cross-sectional shape and dimensional accuracy. The area of cross-section was smaller. Its height changes since the substrate’s raised up and the cover plate’s bulged down. But the width dimension of microchannel was essentially unchanged. The deformation caused by thermal expansion is small. Experimental data show that compressed thickness has a greater impact than temperature.

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Periodical:

Applied Mechanics and Materials (Volumes 246-247)

Pages:

1204-1208

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.246-247.1204

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Online since:

December 2012

Authors:

Lei Huang, Zhang Wang, Chun Peng Chu, Bing Yan Jiang

Keywords:

Bonding, Micro-Channel, Microfluidic Chip

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