Dimensional Synthesis of a Planar Parallel Mechanism for Wafer Transfer with Kinematics Performance

Yan Bing Ni; Wen Xia Guo; Fa Yang Luo

doi:10.4028/www.scientific.net/AMM.252.107

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 252Dimensional Synthesis of a Planar Parallel...

Dimensional Synthesis of a Planar Parallel Mechanism for Wafer Transfer with Kinematics Performance

Abstract:

This paper deals with the dimensional synthesis of a planar parallel mechanism for wafer transfer with kinematics performance. Under the relationship between workspace and parametric, a kinematics performance index, which is composed of the conditioning number of the Jacobian matrix and the motion resolution, is considered as the evaluation criterion. And a new index which is proposed by considering both the mean value and fluctuation of the pre-mentioned index is used to optimally design the dimensional parameters. It is testified that the optimal dimensional parameters can satisfied with the kinematics performance.

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Periodical:

Applied Mechanics and Materials (Volume 252)

Pages:

107-110

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.252.107

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Online since:

December 2012

Authors:

Yan Bing Ni, Wen Xia Guo, Fa Yang Luo

Keywords:

Dimensional Synthesis, Kinematics Performance, Parallel Mechanism

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