Experimental Research of Heat Dissipation of Notebook

Du Ying Wang; Mao De Li

doi:10.4028/www.scientific.net/AMM.268-270.1027

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 268-270Experimental Research of Heat Dissipation of...

Experimental Research of Heat Dissipation of Notebook

Abstract:

The influences and protections of heat dissipation of notebook are discussed. Tests of heat dissipation for three types of notebook are made to analyze and understand characteristic between power dissipation and temperature rising. From the test results it is shown that the influence from power dissipation, environment temperature and fan speed are obvious and a better heat dissipation can be realized by means of forced convection of proper selection of fan speed.

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Periodical:

Applied Mechanics and Materials (Volumes 268-270)

Pages:

1027-1030

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.268-270.1027

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Online since:

December 2012

Authors:

Du Ying Wang, Mao De Li

Keywords:

CPU, Power Consumption, Power Ratio, Temperature Rising

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