Study on the Influence of Temperature and Stress Field to PCB’s Modal

Qin Luo; Su Juan Zhang; Xiao Zhang

doi:10.4028/www.scientific.net/AMM.271-272.1441

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 271-272Study on the Influence of Temperature and Stress...

Study on the Influence of Temperature and Stress Field to PCB’s Modal

Abstract:

With the increasing integration of electronic products, the heat flux density is increasing. Research on the heat dissipation of the PCB attracts more attention. Temperature field of the electronic products always changes a lot, usually leading to a transient stress field in the PCB. Due to the transient temperature field and transient stress field, the PCB’s modal changed. In this paper, the temperature field and the stress field are obtained to explain the reason of the change. The influence on PCB’s modal caused by the temperature field and the stress field are analyzed, on the basis of PCB’s thermal modal analysis, which provide a reference for the PCB design and modal analysis in the future.

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Periodical:

Applied Mechanics and Materials (Volumes 271-272)

Pages:

1441-1445

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.271-272.1441

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Online since:

December 2012

Authors:

Qin Luo, Su Juan Zhang, Xiao Zhang

Keywords:

PCB’s Modal, Stress Field, Temperature Field

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References

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