Effect of TiC Intermediate Layers on the Thermal Conductivity of Copper/Diamond Composites

Qi Ping Kang; Xin Bo He; Shu Bin Ren; Bao Rui Jia; Xuan Hui Qu

doi:10.4028/www.scientific.net/AMM.275-277.1610

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 275-277Effect of TiC Intermediate Layers on the Thermal...

Effect of TiC Intermediate Layers on the Thermal Conductivity of Copper/Diamond Composites

Abstract:

TiC intermediate layers were formed on the surface of diamond particle with reaction of Ti powders in mixed molten NaCl-KCl salts. The copper/diamond composites with TiC-coated diamond particles were fabricated by pressure infiltration. Then the microstructure and thermal conductivity of the obtained copper/diamond composites were studied. The results showed the thermal conductivity of the composites with a density of 5.65 g/cm³ reached 514 Wm^-1 K^-1, which is much higher than with uncoated diamond. The TiC layers synthesized on diamond particles is shown to be an effective way to enhance the thermal conductivity of copper/diamond composite.