Heat Transfer Enhancement of Vertical Heat Sinks with a Piezofan

Abstract:

This study examines several effects, including the piezofan positions, and piezofan arrangements, as well as piezofan height, on the heat transfer enhancement of two typical types of vertical heat sink. Either 30-mm-high or 10-mm-high heat sink having 11 plate-fins or 100 square pin-fins is tested with a running piezofan. The piezofan having Mylar blade is either vertically or horizontally placed above the heat sinks vibrating with resonant frequency of 31 Hz and tip mean-to-peak amplitude of 7.2 mm. The heat transfer coefficient is measured at five different fan locations with fan heights of 12 mm and 16 mm. Results show that the piezofan located at x/L = 0.5 usually performs the highest heat transfer enhancement for a given heat sink, while piezofan located at x/L = 1 usually shows the worst heat transfer enhancement. Depending on the fan arrangements and positions, heat transfer coefficient of the present 10-mm-high plate-fin heat sink shows 1.2 – 2.4 times higher than that under natural convection, while the enhancement factor ranges from 1.1 to 2.6 for 10-mm-high pin-fin heat sink.

• Periodical: Applied Mechanics and Materials (Volumes 284-287)
• Pages: 773-777
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.284-287.773
• Online since: January 2013
• Authors: Jin Cherng Shyu, Jhih Zong Syu
• Keywords: Heat Transfer, Mylar, Piezofan, Pin-Fin, Plate-Fin

References

[1] M. Toda, Voltage-induced large amplitude bending device-PVF2 bimorph-Its properties and applications, Ferroelectrics 32 (1981) 127-133.

DOI: 10.1080/00150198108238683

[2] T. Acikalin, S.M. Wait, S. V. Garimella, and A. Raman, Experimental investigation of the thermal performance of piezoelectric fans, Heat Transfer Eng. 25 (2004) 4-14.

DOI: 10.1080/01457630490248223

[3] M. Kimber, S.M. Wait, and S. V. Garimella, Local heat transfer coefficients induced by piezoelectrically actuated vibrating cantilevers, J. Heat Transfer Vol. 29 (2007) 1168-1176.

DOI: 10.1115/1.2740655

[4] T. Acikalin, S.V. Garimella, A. Raman, and J. Petroski, Characterization and optimization of the thermal performance of miniature piezoelectric fans, Int. J. Heat Fluid Flow 28 (2007) 806-820.

DOI: 10.1016/j.ijheatfluidflow.2006.10.003

[5] M. Kimber, and S.V. Garimella, Cooling performance of arrays of vibrating cantilevers, J. Heat Transfer 131 (2009) 11401-11408.

DOI: 10.1115/1.3153579

[6] M. Kimber, and S.V. Garimella, Measurement and prediction of the cooling characteristics of a generalized vibrating piezoelectric fan, Int. J. Heat Mass Transfer 52 (2009) 4470-4478.

DOI: 10.1016/j.ijheatmasstransfer.2009.03.055

[7] S.-F. Liu, R.-T. Huang, W.-J. Sheu, and C.-C. Wang, Heat transfer by a piezoelectric fan on a flat surface subject to the influence of horizontal/vertical arrangement, Int. J. Heat Mass Transfer 52 (2009) 2565-2570.

DOI: 10.1016/j.ijheatmasstransfer.2009.01.013

[8] M.K. Abdullah, M.Z. Abdullah, M.V. Ramana, C.Y. Khor, K.A. Ahmad, M.A. Mujeebu, Y. Ooi, and Z.M. Ripin, Numerical and experimental investigations on effect of fan height on the performance of piezoelectric fan in microelectronic cooling, Int. Commun. Heat Mass Transfer 36 (2009) 51-58.

DOI: 10.1016/j.icheatmasstransfer.2008.08.017

[9] J. Petroski, M. Arik, and M. Gursoy, Optimization of piezoelectric oscillating fan-cooled heat sinks for electronics cooling, IEEE Trans. Compon. Packag. Technol. 33 (2010) 25-31.

DOI: 10.1109/tcapt.2009.2023859

[10] D.W. van de Pol, and J.K. Tierney, Free Convection Heat Transfer from Vertical Fin-Arrays, IEEE Transactions on Parts, Hybrids, and Packaging 10 (1973) 267-271.

DOI: 10.1109/tphp.1974.1134861