Finite Element Modeling of Induction Heating on Easy-Open-End Dies

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Through the magnetic-thermal coupling of ANSYS, the finite element modeling (FEM) of induction heating of the easy-open-end die was completed and the distribution of the dies temperature was determined. Simulation results showed that the dies cylinder surface temperature was high and close to the center was low with a small difference in temperature of about 3°C. Both simulation and experiment results demonstrated the benefits of using induction heating which could guarantee rapid and even heating. This result meant that the dies height varies evenly and was easy to be controlled. The results supplied a strong theoretical foundation for the project of real-time control easy-open-ends notch height.

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881-885

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June 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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[1] G.S. Dahake, Role of induction heating in lean manufacturing, Heating treating progress, 6(2006) 31–36.

Google Scholar

[2] S. Hansson, M. Fisk, Simulation and measurements of combined induction heating and extrusion processes, Finite elements in analysis and design, 46(2010) 905–915.

DOI: 10.1016/j.finel.2010.06.004

Google Scholar

[3] D.X. Chen, Machinery's Handbook. Chemical Industry Press, Beijing, 2008.

Google Scholar

[4] M. Fish, Simulation of induction heating in manfacturing, Licentiate Thesis, 42(2008).

Google Scholar

[5] S.J. Chang, P.C. Xie, X.T. He and W.M. Yang, Numerical simulation of temperature field in barrel of injection molding machine during induction heating process based on ANSYS software, Advanced Materials Research, 87-88(2010)16-21.

DOI: 10.4028/www.scientific.net/amr.87-88.16

Google Scholar

[6] G.X. Zhang, Y. Tao, Y.K. Wang and Y.J. Zhang Research of dynamic forcasting model and ANSYS analysis of temperature field in slab, Hot Working Technology , 15( 2009)141-143.

Google Scholar