Effect of the Er on Resistivity and Spreading Properties of Bi5Sb8Sn Solder Alloy

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Abstract:

In this paper a novel quaternary alloy is formed by adding a small amount of rare earth Er (RE) into Bi5Sb8Sn solder alloy to improve its technological properties. The influences of Er on the resistivity and spreading properties of the novel solder alloy were systematically investigated. Studied results show that adding 0.25~0.75wt.% RE into Bi5Sb8Sn solder alloy, the resistivity changes little,while the wettability demonstrated a significant improvement.The spreading area reaches 27.22mm2 and increases by 23% than the Bi5Sb8Sn matrix soler when the content of RE is 0.5wt.%.With increasing the content of Er ,the spreading area of solder alloy decreases, but it is still higher than that of the Bi5Sb8Sn solder alloy. It is mainly closely related to new phases with RE ,the form of compounds and thickness of interface intermetallic compounds in the Bi5Sb8SnRE solder alloy.

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147-150

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June 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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[1] Z T Hu, D R Xu: Electronics Process Technology Vol. 26(2005), P. 125-128

Google Scholar

[2] J Glazer: Journal of Eletronic Materials Vol, 23 (1994), P. 693-697

Google Scholar

[3] Y C Liu, J W R Teo, S K Tung and K H Lam: Journal of Alloys and Compounds Vol. 448(2008), P.340–343

Google Scholar

[4] C H Du,F Chen and Y F Du: Electronic Components and Materials Vol. 123(2004), P. 34~36

Google Scholar

[5] J Glazer: Journal of Eletronic Materials Vol,23 (1994), P. 693-697

Google Scholar

[6] L F Feng, Y F Yan and X X Guo: Materials Science Froum Vol. 610-613(2009), P. 537-541.

Google Scholar

[7] Y W Shi, Z D Xia and Y P Lei: Electronics Process Technology Vol. 26(2005), P. 6-9.

Google Scholar

[8] B Li, Y W Shi and Y P Lei: Journal of Electronic Materials Vol. 34(2005), P. 217

Google Scholar