Modeling and Simulation of PCB Assembly under Board-Level Drop Impact

Abstract:

Finite element (FE) method is an efficient and power tool, and is adopted to analyze dynamic response of printed circuit board (PCB) assembly. First, FE model of PCB assembly was established. Second, the dynamic behaviors of ball gird array (BGA) lead-free solder joint were obtained when the PCB assembly was subjected to a half-sine acceleration pulse. Results show that the maximum tensile stresses occur at solder joints located at the four outermost corners of BGA and solder joints at outermost corners are the most vulnerable to crack. In addition, it can be found during FE analysis that the solder joint reliability can be enhanced as the PCB damping increases and input acceleration level reduces.

• Periodical: Applied Mechanics and Materials (Volumes 34-35)
• Pages: 451-455
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.34-35.451
• Online since: October 2010
• Authors: Fang Liu, Guang Meng
• Keywords: BGA, Board-Level Drop Impact, Finite Element (FE) Simulation, Lead-Free Solder Joint

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