A Novel 3-D Topography Model for Micro-Manufacturing Process Simulations

Abstract:

This paper presents a novel 3-D topography model for micro-manufacturing process simulations, which uses unit vector of the parametric surface as an important parameter to achieve the surface evolution algorithm. According to various physical models of given fabrications, it can be applied to simulations of isotropic/anisotropic etching, deposition, and other processes with surface evolution direction dependence. The simulation results of this model are 3-D visible of variable perspective. Furthermore, simplification is introduced in some special case to reduce memory requirement and calculation time. Some isotropic etching simulations are performed as examples, and the results indicate the accurate simulated surface.

• Periodical: Applied Mechanics and Materials (Volumes 34-35)
• Pages: 477-481
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.34-35.477
• Online since: October 2010
• Authors: Dong Liang Xu, Jian Zhang
• Keywords: 3D Simulation, Gauss Integration, Micro Manufacturing, Model

References

[1] Masato Fujinaga and Norihiko Kotani: 3-D Topography Simulator (3-D MULSS) Based on a Physical Description of Material Topography. IEEE Transactions on Electron Devices. VOL. 44, NO. 2(1997), pp.226-238.

DOI: 10.1109/16.557710

[2] Edward W. Scheckler and Andrew R. Neureuther: Models and Algorithms for Three-Dimensional Topography Simulation with SAMPLE-3D. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. VOL. 13, NO. 2(1994), pp.219-230.

DOI: 10.1109/43.259945

[3] A. Moniwa, T. Matsuzawa, T. Ito and H. Sunami: A Three-dimensional Photoresist Imaging Process Simulator for Strong Standing-Wave Effect Environment. IEEE Tran. Computer-Aided Design. VOL. CAD-6(1987), pp.431-437.

DOI: 10.1109/tcad.1987.1270289

[4] Masato Fujinaga and Norihiko Kotani: 3-D Topography Simulator (3-D MULSS) Based on a Physical Description of Material Topography. IEEE Transactions on Electron Devices. VOL. 44, NO. 2 (1997), pp.226-238.

DOI: 10.1109/16.557710

[5] J. Du and N. Olhoff: Topological Optimization of Continuum Structures with Design-dependent Surface Loading-Part 2: Algorithm and Examples for 3D Problem. Structural and Multidisciplinary Optimization. VOL. 27 (2004), pp.166-177.

DOI: 10.1007/s00158-004-0380-5

[6] Jian Zhang, Qing-An Huang and Wei-Hua Li: An ICP Etch Model Based on Time Multiplexed Deep Etching. Proc. Of SPIE Vol. 6032, 60320G(2006).

[7] Information on http: / www. oxfordplasma. de/process/si_etch. htm.