Investigation on Condition Monitoring of Convertor

Sheng You Xu; Min You Chen; Li Ran

doi:10.4028/www.scientific.net/AMM.347-350.89

Paper Titles

Evaluation, Prediction and Control on the Earth's Health
p.68

A Displacement Measurement System Based on Artificial Compound-Eye Imaging for 2½D Space
p.72

Study & Manufacture RM of Industrial CT System
p.80

Design of Exhaust Temperature Test System of a Certain Type Aeroengine
p.85

Investigation on Condition Monitoring of Convertor
p.89

The Design of Sound and Light Controlled Corridor LED Lamp Based on Double Integration Detection
p.93

Overview on Intelligent Control Strategy of BLDC Motor Based on PID Algorithm
p.98

A Short-Range Millimeter-Wave Detector System
p.102

The Feasibility Study of Vibration Transmissibility Applied to Structure Damage Identification
p.107

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 347-350Investigation on Condition Monitoring of Convertor

Investigation on Condition Monitoring of Convertor

Abstract:

Packaging-related failure has been recognized as one of the principal root causes of convertor failures, condition monitoring is a cost-effective means of improving convertor reliability by power electronic system operator. In this paper, an approach is presented to monitor failure by identifying the case temperature. Firstly, the case temperature is measured at real-time, the transient curves are built based on the measured data respectively. Then, extracting the slope of case temperature from the transient curve during its operation. It is because that the external characteristic of convertor is the reflection of internal condition, once the slope value of the transient curve is higher than that of the normal condition at the same working point, taking account of the masking effect of measuring accuracy and errors, a conclusion can be get that the convertor condition is abnormal. Finally, experiment has validated the proposed method.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volumes 347-350)

Pages:

89-92

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.347-350.89

Citation:

Cite this paper

Online since:

August 2013

Authors:

Sheng You Xu, Min You Chen, Li Ran

Keywords:

Case Temperature, Condition Monitoring, Convertor Reliability

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] D. Xiang, L. Ran, P. Tavner, S. Yang, A. Bryant, P. Mawby: Monitoring Solder Fatigue in a Power Module Using the Rise of Case-above-ambient Temperature. IEEE Transactions on industry application, 2011, 47(6), pp.2578-2591.

DOI: 10.1109/tia.2011.2168556

Google Scholar

[2] M. Chen,S. Xu,L. Ran,D. Xiang, P. Wyllie: Predict of Case Temperature for Monitoring IGBT Power Module using Artificial Neural Network, international review of electrical engineering, February 2012, 7(1), pp.3240-3247.

Google Scholar

[3] P.J. Tavner: Review of condition monitoring of rotating electrical machines, IET Electric Power Applications, 2008, 2(4), pp.215-247.

DOI: 10.1049/iet-epa:20070280

Google Scholar

[4] M. Ciappa: Selected Failure Mechanisms of Modern Power Modules, Microelectronics Reliability, 2002, 47 (5), pp.653-667.

DOI: 10.1016/s0026-2714(02)00042-2

Google Scholar

[5] A. Bryant, S. Yang, P. Mawby, D. Xiang, L. Ran, P. Tavner, P. R. Palmer: Investigation Into IGBT dV/dt During Turn-Off and Its Temperature Dependence, IEEE Transactions on industry application, 2011, 26(10), pp.3019-3031.

DOI: 10.1109/tpel.2011.2125803

Google Scholar

[6] D. Xiang, L. Ran, P. Tavner, S. Yang, A. Bryant, P. Mawby: Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification, IEEE Transactions on Power Electronics, 2011, 27(1), PP. 235 – 247.

DOI: 10.1109/tpel.2011.2160988

Google Scholar