Effects of Ni-B Addition on Microstructure and Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder

Jun Feng Qu; Jun Xu; Qiang Hu; Fu Wen Zhang

doi:10.4028/www.scientific.net/AMM.372.30

Paper Titles

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Development and Application of New Design Method by High-Strength Composite Material - Fusing of Optimum Strength Evaluation and Product Design
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Sensitivity of the CFD Mesh for a Single Rising Bubble in a Hallimond Tube
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Effects of Ni-B Addition on Microstructure and Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder
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Comparison of Liquid Phase Sintering and Cu-Melt Infiltration Methods to Consolidate 80W-Cu Composite Using Nickel as Sintering Activator
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Design of the Diffuse Reflector Cup with Microstructure and the Research on the Optical Performance
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Scientifically Based Choice of Heat-Resistant Cast Aluminum Alloys of New Generation
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 372Effects of Ni-B Addition on Microstructure and...

Effects of Ni-B Addition on Microstructure and Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder

Abstract:

The solder/substrate reactions, for Sn-1.0Ag-0.5Cu, Sn-1.0Ag-0.5Cu-0.05Ni and Sn-1.0Ag-0.5Cu-0.05Ni-0.02B, were evaluated in what concerns the melting temperature, microhardness, morphology of the solder and chemical composition of the interface layer. The phases formed at the interface between the Cu Substrate and a molten lead-free solder were studied with different stage times. The evaluation of their chemical compositions were performed by Scanning Electron Microscopy (SEM) and Energy Dispersive Spectrometer (EDS).