Application of Thermal Design Method for Industrial Ethernet Switch

Abstract:

With the rapid development of electronic technology, the integrations of chips and modules become much more complex. Various types of communication equipment with more functions which make the heat of the device to increasingly become a problem. High temperatures may seriously affect the validity and reliability of electronic equipment and components. In order to dissipate the heat to the ultimate sink, thermal design need to design low thermal resistance paths both inside the electronic device and between the electronic device and the external environment. Industrial Ethernet switch runs in harsh environment, and the reliability, stability, security, environmental adaptability requirements higher than that of commercial Ethernet switches, these require a higher standard thermal design.

• Periodical: Applied Mechanics and Materials (Volumes 380-384)
• Pages: 3413-3416
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.380-384.3413
• Online since: August 2013
• Authors: Jing Tao, Peng Wu, Lei Chen, Chuan Liu
• Keywords: Heat Dissipation, Industrial Ethernet Switch, Thermal Design

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