Study on Magnetron Sputtering Process of Stainless Steel Particles Sputtering on Copper Substrate Based on LS-DYNA

Abstract:

The deformation process of stainless steel particle sputtering on copper substrate to make coat was simulated by ANSYS/LS-DYNA software in the paper. The results showed that: when the steel particles are sputtered on the copper substrate, the contacting place of copper substrate with stainless steel particle top generates maximum stress and strain firstly, and then stainless steel particle shrinks from the bottom to the center, while the top flattens to the both sides. Subsequently, the bottom of the particle gradually spreads along the substrate with the stress increasing gradually, while the strain distribution and top of the particles basically unchanged, then, the particle flattens and its stress gradually spreads to particle interior, at the same time, the bottom of particle gradually shrinks and its top gradually expands to the end. Through analyzing equivalent stress and strain distributions, the kinetic and internal energy distributions of sputtering particle unit and substrate unit contacting together, the variation rules of mechanics and energy parameters in the sputtering process are elaborated further. It laid an important theoretical basis about exploring the basic laws and mechanics parameters variation in magnetron sputtering coating process.

• Periodical: Applied Mechanics and Materials (Volumes 395-396)
• Pages: 1190-1193
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.395-396.1190
• Online since: September 2013
• Authors: Zhi Ping Zhang, Han Wu Liu, Hai Mei Feng, Zhi Jun Liu
• Keywords: LS-DYNA Software, Magnetron Sputtering, Particle, Selective Absorbing Coating, Substrate, Temperature Field Distribution

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