Electroless Plating of Cu on Multi-Walled Carbon Nanotubes

Rong Rong Dai; Xin Min Huang; Zhang Ping Fei

doi:10.4028/www.scientific.net/AMM.395-396.154

Paper Titles

Effect of Content and Layer Thickness on the Corona-Resistance of PI/TiO₂ Nanocomposite Films
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Electrospun Ketoprofen Sustained Release Nanofibers Prepared Using Coaxial Electrospinning
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The Nanocapsulation Research Progress in Food Industry
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The Preparation and Tribological Property Investigation of Chrysotile Nanotubes on the Grease
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Electroless Plating of Cu on Multi-Walled Carbon Nanotubes
p.154

Synthesis of Silver Nanoparticles through the Soft Template Method and their Applications to Surface-Enhanced Raman Scattering
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Simulation of the Effect of Nano Phase Size on Microstructure Evolution in Nanocomposite Ceramic Tool Materials
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Synthesis and Characterization of N-Doped Meso/Macroporous Carbon
p.166

Investigation on the Photovoltaic Performance of ZnO Nanoarrays Prepared by Chemical Bath Deposition and Hydrothermal Method
p.170

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 395-396Electroless Plating of Cu on Multi-Walled Carbon...

Electroless Plating of Cu on Multi-Walled Carbon Nanotubes

Abstract:

A layer of densely distributed copper particles has been deposited on the surface of multi-walled carbon nanotubes (MWCNTs) by pretreatment including oxidation, sensitization and activation and electroless plating methods. Due to our experiments, the rate of deposition will increase by increasing the PH value and temperature of the solution bath properly. Different morphologies of coatings have been obtained with different PH values and temperatures. The most suitable PH value and temperature of the plating bath were 11.5 and 20°C, respectively.