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Modulations and Core-Shell Effect on Positive Temperature Coefficient of Resistivity of Na0.5Bi0.5TiO3 Ceramics by Electrically Heterogeneous (LiCe) Phases

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Abstract:

Positive temperature coefficients of resistivity (PTCR) have been realized in lead free Na0.5Bi0.5TiO3 (NBT) based ceramics by (LiCe) addition. The modulations on their volumes have been obtained continuously in the wide temperature range of 50-479 °C. X-ray diffraction and scanning electron microcopy results display that second-phase adulterants exit on NBT grain boundaries, and even create core-shell structures around NBT grains with the increment of additions. Impedance analysis reveals that electrically heterogeneous structures of grain and grain boundaries have contributions to the PTCR effects of NBT-based ceramics, especially for core-shell structure. All results indicate NBT-based system can be used for thermistor applications at high temperature.

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Periodical:

Applied Mechanics and Materials (Volumes 395-396)

Pages:

84-87

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.395-396.84

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Online since:

September 2013

Authors:

Zheng Fa Li, Yu Ting Fu, Yong Xiang Li, Qun Xi Zhang

Keywords:

Ceramic, Core-Shell, Na0.5Bi0.5TiO3, Temperature Coefficient of Resistivity

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] P. H. Xiang, H. Takeda, and T. Shiosaki, Appl. Phys. Lett. Vol. 91(2007), p.162904.

Google Scholar

[2] L. J. Lauhon, M. S. Gudiksen, C. L. Wang et al., Nature Vol. 420(2002), p.57.

Google Scholar

[3] P. Fiorenza, R. Lo Nigro, P. Delugas et al., Appl. Phys. Lett. Vol. 95(2009), p.142904.

Google Scholar

[4] D. C. Sinclair, A. R. West, J. Appl. Phys. Vol. 66(1989), p.3850.

Google Scholar

[5] M. Kuwabara and K. Kumamoto, J. Am. Ceram. Soc. Vol. 66 (1983), p. C214.

Google Scholar

[6] G. O. Jones and P. A. Thomas, Acta Crystallogr., Sect. B: Struct. l Sci. Vol. 58 (2002), p.168.

Google Scholar

[7] M. L. Zhao, C. L. Wang, W. L. Zhong, J. F. Wang, H. C. Chen, Acta Phys. Sinica Vol. 52(2003), p.229.

Google Scholar

[8] K. Prasad, K. Kumari, Lily et al., Adv. Appl. Ceram. Vol. 106(2007), p.241.

Google Scholar

[9] W. Z. Lu, G. F. Fan, X. H. Wang et al., Jpn. J. Appl. Phys. Vol. 145(2006), p.8763.

Google Scholar

[10] C. M. Wang and J. F. Wang, Appl. Phys. Lett. Vol. 89(2006), p.202905.

Google Scholar

[11] Z. G. Gai, J. F. Wang, M. L. Zhao et al., Scripta Mater. Vol. 59(2008), p.115.

Google Scholar

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