Parametric Study in Thermal Optimization Design of Multi-Chip Module

Abstract:

A three dimensional model of Multichip Module (MCM) is built with ANSYS. The temperature and thermal stress field distribution are studied. Taking into account the global heat dissipation and the local thermal stress, the effect of structure parameters and material properties on the maximum chip junction temperature and the maximum thermal stress of MCM are studied. The four design parameters are the thickness of the substrate, thermal conductivity of the substrate, thermal conductivity of the thermal grease and convection heat transfer coefficient. This paper gave the method to reduce the temperature, and the results provided an efficient basis for the compromising design of thermal stress, which is benefit for the thermal optimization of MCM.

• Periodical: Applied Mechanics and Materials (Volume 432)
• Pages: 358-363
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.432.358
• Online since: September 2013
• Authors: Jian Zhang, Dong Lai Zhang
• Keywords: ANSYS, Design Parameter, Multichip Module (MCM), Optimization Design, Temperature Field

References

[1] J. P. Gu, M. Q. Hu, Jin Long, Q. F. Han, D. M. Wang, A. J. Wang, Thermal Analysis of Driving-Unit for Ring-Type Traveling-Wave Ultrasonic Motor Based on MCM, Transactions of China Electro technical Society, vol. 25, no. 2, pp.49-53, Feb. (2010).

[2] C. D. Qiu, C. G. Zhao. Design Principle of the structure of Electronic equipment. NanJing: Southeast University Press, (2005).

[3] B. Ozmat, Interconnect technologies and the thermal performances of MCM, IEEE Trans Components, Packaging, and Manufacturing Technology, vol. 15, no. 5, p.860, (1992).

DOI: 10.1109/33.180052

[4] J. G. Wang, Research on the Packaging Technology for Integrated Power Electronics Module, NanJing: Nanjing University of Aeronautics and Astronautics, (2006).

[5] S. Y. Wei, Z. G. Li, Y. H. Cheng, R. Y. Huang, M. Zhou, Finite Element Simulation for 3-D Thermal Analysis of MCM, Microelectronics, vol. 35, no. 4, pp.371-374, Aug. (2005).

[6] X. G. Qin, P. Yang, C. J. Shen, N. B. Liao, Finite element simulation for three dimensional thermal analysis of multi- chip module, Electronic components and materials, vol. 26, no. 9, pp.10-13, Sep. (2007).

[7] Z. H. Lv, The Transient Heat Analysis for a Power Supply on Missile, Electro- Mechanical Engineering, vol. 26, no. 4, pp.14-17, Apr. (2010).

[8] T. -Y. Lee et al., Application of CFD technology electronics thermal management, IEEE Trans. Components and Package., Manuf. Technol. B, Adv. Package., vol. 18, no. 3, pp.511-520, Aug. (1995).

[9] S. Sridhar. Evaluation of a thermal design tool for electronics a three chip MCM as a case study, in Proc. 45th Electronic Components and Technology Conf, May 1995, pp.876-878.

DOI: 10.1109/ectc.1995.517791

[10] Y. W. Xu, The Study for Heat Analysis Technology of Stacked Three-Dimension Multi-Chip Module, Electronics & Packaging, vol. 10, no. 81, pp.4-7, Jan. (2010).

[11] Y. S. Cao, T. Jiang, J. Liu, B. H, Lian, The Study for Thermal Analysis Technology of Three Dimension SRAM Components, ICEPT 2007. 8th International Conference on Electronic Packaging Technology, Aug. 2006, pp.1-4.

DOI: 10.1109/icept.2007.4441418

[12] C. Y. Huang, B. Wang, T. M. Li, H. G. Wei, Analysis of temperature field of Embedded Multi-Chip Module, Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on Digital Object Identifier: 10. 1109/ICEPT. 2011. 6066952.

DOI: 10.1109/icept.2011.6066952

[13] Y. Chen, C. Xu, Application of Finite Element Analysis Software ANSYS in MCM, Electronic Engineer, vol. 33, no. 2, pp.9-11, Feb. (2007).

[14] Bhopte, Siddharth, Study of the Thermal Characterization of a High Performance Flip Chip Package, " Thermal and Thermomechanical Phenomena in Electronic Systems, May 2008, pp.302-309.

DOI: 10.1109/itherm.2008.4544284

[15] E. Dallago and G. Venchi, Thermal Characterization of Compact Electronic Systems: A Portable PC as a Study Case, IEEE Transactions on Power Electronics, vol. 17, no. 2, pp.187-195, Mar. (2002).

DOI: 10.1109/63.988829

[16] Y. C. Wang, W. D. Ma, C. Z. Lv, Z. G. Li, FEM-Based Thermal Analysis of DC/DC Power Module, Microelectronics, vol. 39, no. 1, pp.101-104, Feb. (2009).

[17] Y. G. Wang, L. Wu, X. Q. Cui, W. C. Wu, A Study on Packaging Thermal Stress of IGBT Modules, no. 6, pp.52-54, Dec. (2000).

[18] F. Zhang. Study on thermal analysis and thermal design of DC/DC modular circuit based on ANSYS [D]. Chongqing: Chongqing University, (2008).

[19] Y. J. Cheng. Thermal Dissipation and Thermal Mechanical Reliability Study for MCM-L, Shanghai: University of Chinese Academy of Sciences, (2006).

[20] H. C. Cheng, I. C. Chung, W. H. Chen, Response Surface Based Optimization Approach for Thermal Placement Design of Chips in Multiple-Chip Modules, IEEE Transactions on Components and packaging technology, vol. 32, no. 3, pp.531-541, Sep. (2009).

DOI: 10.1109/tcapt.2009.2022272

[21] H. C. Cheng, W. H. Chen, I. C. Chung, Integration of Simulation and Response Surface Methods for Thermal Design of Multichip Modules, " Transactions on Components and packaging technology, vol. 27, no. 2, pp.359-372, Jun. (2009).

DOI: 10.1109/tcapt.2004.828560