Parasitic Consideration of Package Design within Press Pack IGBT

Peng Zhang; Rong Gang Han; Wen Guang Liu; Ying Ying Su; Rui Jin; Kun Shan Yu; Jun Liu; Hai Long Bao; Yu Zhang; Jia Jie Che

doi:10.4028/www.scientific.net/AMM.433-435.1782

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 433-435Parasitic Consideration of Package Design within...

Parasitic Consideration of Package Design within Press Pack IGBT

Abstract:

Simulation technology provides a powerful tool for the package design. Parasitic are one of the most important factors for press pack IGBT. By the aid of the simulation software, the package parasitic is extracted and the current distribution among paralleled chips is analyzed. Simulation results confirm the theoretical analysis and verify the efficacy of the new approach.

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Periodical:

Applied Mechanics and Materials (Volumes 433-435)

Pages:

1782-1785

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.433-435.1782

Citation:

Cite this paper

Online since:

October 2013

Authors:

Peng Zhang, Rong Gang Han, Wen Guang Liu, Ying Ying Su, Rui Jin, Kun Shan Yu, Jun Liu, Hai Long Bao, Yu Zhang, Jia Jie Che

Keywords:

Package, Parasitic, Press Pack, Stray Inductance

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References

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