Interfacial Reaction Thermodynamics between Sn-Cu-Ag Solder and Ni Substrate

Abstract:

Interfacial reaction during wetting and spreading of Sn-Ag-Cu solder on Ni substrate is a key factor in order to improve the mechanical properties of the joints and the weld quality. Therefore, it’s important to focus on the thermodynamic and kinetic analysis of this interface reaction. In this paper, the sessile drop method was used to study the spreading contour evolution. The Kissinger method was used to calculate thermo-kinetic parameters of reactions between Sn-Ag-Cu solder and Ni substrate based on DTA data. The results show that Cu reduces activation energy and reaction rate of Sn-Ag-Cu/Ni system. (Cu, Ni)₆Sn₅ phase mainly constitute the interface reaction layer of Sn-Ag-Cu/Ni. As the temperature increases, partial (Cu, Ni)₆Sn₅ phase is substituted by Ni₃Sn₄ phase.

• Periodical: Applied Mechanics and Materials (Volumes 433-435)
• Pages: 2020-2024
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.433-435.2020
• Online since: October 2013
• Authors: Hong Yan Xu, Hu Wu, Bing Sheng Xu, Yan Wu
• Keywords: Electronic Material, Intermetallic Compound, Metals and Alloys, Thermodynamics of Processes in Materials, Welding

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