Optimization Design the Configuration Sizes of Multi-Layer Rectangle Micro-Channel Heat Sink

Abstract:

The configuration sizes of multi-layer rectangle micro-channel heat sink are optimized, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure. Taking the thermal resistance and the pressure drop as goal functions, a binary-objective optimization model was proposed for the multi-layer rectangle micro-channel heat sink based on Sequential Quadratic Programming (SQP) method. The number of optimized micro-channel in width n₁ and that in height n₂ are 24 and 3, the width of optimized micro-channel W_c and fin W_f are 360 and 55μm, the height of optimized micro-channel H_c is 1000μm, and the corresponding total thermal resistance of the whole micro-channel heat sink is 1.5429 °C/W. The corresponding pressure drop is about 2.3454 Pa. When the velocity of liquid is larger than 0.3 m/s, the effect of change of velocity of liquid on the thermal resistance and pressure drop can be neglected.

• Periodical: Applied Mechanics and Materials (Volumes 444-445)
• Pages: 1101-1106
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.444-445.1101
• Online since: October 2013
• Authors: Li Feng Wang, Bao Dong Shao, He Ming Cheng, Ying He
• Keywords: Multi-Layer Rectangle Micro-Channel Heat Sink, Optimization Design, Pressure Drop, Thermal Resistance

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