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Optimization Design the Configuration Sizes of Multi-Layer Rectangle Micro-Channel Heat Sink

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Abstract:

The configuration sizes of multi-layer rectangle micro-channel heat sink are optimized, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure. Taking the thermal resistance and the pressure drop as goal functions, a binary-objective optimization model was proposed for the multi-layer rectangle micro-channel heat sink based on Sequential Quadratic Programming (SQP) method. The number of optimized micro-channel in width n1 and that in height n2 are 24 and 3, the width of optimized micro-channel Wc and fin Wf are 360 and 55μm, the height of optimized micro-channel Hc is 1000μm, and the corresponding total thermal resistance of the whole micro-channel heat sink is 1.5429 °C/W. The corresponding pressure drop is about 2.3454 Pa. When the velocity of liquid is larger than 0.3 m/s, the effect of change of velocity of liquid on the thermal resistance and pressure drop can be neglected.

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Periodical:

Applied Mechanics and Materials (Volumes 444-445)

Pages:

1101-1106

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.444-445.1101

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Online since:

October 2013

Authors:

Li Feng Wang, Bao Dong Shao, He Ming Cheng, Ying He

Keywords:

Multi-Layer Rectangle Micro-Channel Heat Sink, Optimization Design, Pressure Drop, Thermal Resistance

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] D.B. Tuckerman, R.F.W. Pease, High-performance heat sinking for VLSI, IEEE Electronic Device Letter 2, (1981), pp.126-129.

DOI: 10.1109/edl.1981.25367

Google Scholar

[2] K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. Azid, Z.A. Zainal, Optimizaiton of thermal resistance of stacked micro-channel using genetic algorithms, International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 15 Iss: 1 (2005).

DOI: 10.1108/09615530510571930

Google Scholar

[3] J. Li and G. P. Peterson, 3-Dimensional numerical optimization of silicon-based high performance parallel micro-channel heat sink with liquid flow, International Journal of Heat and Mass Transfer, Vol. 50, (2007), pp.2895-2904.

DOI: 10.1016/j.ijheatmasstransfer.2007.01.019

Google Scholar

[4] Zheng-Hua Wang, Xiao-Dong Wang, Wei-Mon Yan, Yuan-Yuan Duan, Duu-Jong Lee and Jin-Liang Xu, Multi-parameters optimization for micro-channel heat sink using inverse problem method, International Journal of Heat and Mass Transfer, Vol. 54, (2011).

DOI: 10.1016/j.ijheatmasstransfer.2011.01.029

Google Scholar

[5] Tu-Chieh Hung, Wei-Mon Yan, Xiao-Dong Wang and Yu-Xian Huang, Optimal design of geometric parameters of double-layered micro-channel heat sinks, International Journal of Heat and Mass Transfer, Vol. 55, (2012), pp.3262-3272.

DOI: 10.1016/j.ijheatmasstransfer.2012.02.059

Google Scholar

[6] Shao, B.D., Sun, Z.W. and Wang, L.F., Optimization design of micro-channel cooling heat sink, International Journal of Numerical Methods for Heat and Fluid Flow, Vol. 17, No. 6, (2007), pp.628-637.

DOI: 10.1108/09615530710761243

Google Scholar

[7] Birur, G.C., Sur, T.W. and Paris, A.D. et al, Micro/nano spacecraft thermal control using a MEMS-based pumped liquid cooling system, SPIE Micromachining and Microfabrication, (2001), pp.21-24.

DOI: 10.1117/12.443059

Google Scholar

[8] Kim, S. J. and Kim, D., Forced convection in microstructures for electronic equipment cooling, Journal of Heat Transfer, Vol. 21, (1991), pp.639-645.

DOI: 10.1115/1.2826027

Google Scholar

[9] Wu, H.Y. and Cheng, P. , An experimental study of convective heat transfer in silicon micro-channel with different surface conditions, International Journal of Heat and Mass Transfer, Vol. 46, No. 14, (2003), pp.2547-2556.

DOI: 10.1016/s0017-9310(03)00035-8

Google Scholar

[10] Li, J., Peterson, G. P., and Cheng P., Three-dimensional analysis of heat transfer in a micro-heat sink with single phase flow, International Journal of Heat and Mass Transfer, Vol. 47, (2004), pp.4215-4231.

DOI: 10.1016/j.ijheatmasstransfer.2004.04.018

Google Scholar