Analysis of PCB via for Signal Integrity Using ANOVA

Shi Lei Zhou; Ya Lin Guan; Xin Kun Tang

doi:10.4028/www.scientific.net/AMM.446-447.956

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 446-447Analysis of PCB via for Signal Integrity Using...

Analysis of PCB via for Signal Integrity Using ANOVA

Abstract:

This paper based on ANOVA (ANalysis Of VAriance) presents an investigation in the design of signal via in multilayered printed circuit boards (PCB) technology from a signal integrity point of view. Using the concept of the orthogonal array (OA), different vias physical aspect ratios have been set in the analysis. The impacts of these parameters are investigated with the help for a full-wave electromagnetic simulation soft HFSS. This study demonstrates the factors which is the most influence on the signal integrity.

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Periodical:

Applied Mechanics and Materials (Volumes 446-447)

Pages:

956-960

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.446-447.956

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Online since:

November 2013

Authors:

Shi Lei Zhou, Ya Lin Guan, Xin Kun Tang

Keywords:

Analysis of Variance (ANOVA), Design of Experiment (DOE), HFSS, Orthogonal Array, Signal Integrity, VIA

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