Thermal Design of Power IC Chip Based on Icepak

Li Fei Pang

doi:10.4028/www.scientific.net/AMM.456.278

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 456Thermal Design of Power IC Chip Based on Icepak

Thermal Design of Power IC Chip Based on Icepak

Abstract:

There was a thermal model established for the packaged power IC chip which is usually used in the design of a class amplifier. After the theoretical analysis of the equivalent chip thermal resistance model carried out on the basis of thermal resistance theory, the optimization and calculation of the baseboard's material and thickness were simulated with Icepak. The acceptable thermal structure of was showed as suggestions for the reliability of chip with discussions of the simulation.

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Periodical:

Applied Mechanics and Materials (Volume 456)

Pages:

278-281

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.456.278

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Online since:

October 2013

Authors:

Li Fei Pang

Keywords:

Icepak, Optimization, Power IC Chip, Thermal Design

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