Effect of Ce Co-Deposition on Phase Structure and Thermal Stability of Ni-Cu-P Alloy

Abstract:

Two nickel base multicomponent Ni-Cu-P, Ni-Cu-P-Ce alloy coatings were prepared using electroless plating method in low acidity condition, and examined by scanning electronic microscope, x-ray diffractometer and x-ray flourometer respectively on its morphology, component and structure characteristic. Thermodynamic stability of the two samples were also examined by thermal analysis method. Research revealed a microcrystalline characteristic with compact and tight surficial cellular structure of Ni-Cu-P-Ce coating. And addition of Cu and Ce into Ni-P alloy could enhance thermodynamic stability of the coating, and let coatings transformation temperature from amorphous state to crystalline state increase approximately to 480°C Celsius. X-ray diffraction analysis indicated the reaction products to be crystal grains of nickel atoms and intermetallic compound of Ni₃P.

• Periodical: Applied Mechanics and Materials (Volumes 457-458)
• Pages: 248-251
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.457-458.248
• Online since: October 2013
• Authors: Hua Sun*, Hong Fang Ma, Li Ming Feng, Xiao Fei Guo
• Keywords: Co-Deposition, Electroless Plating, Microcrystal Structure, Thermodynamic Stability

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