Optimal Yield Rate in ACF Cutting Process of TFT-LCD Module Using Orthogonal Particle Swarm Optimization

Abstract:

Anisotropic Conductive Film (ACF) is essential material in LCM (Liquid Crystal Module) process. It is used in bonding process to make the driving circuit conductive. Because the price of TFT-LCD is much lower than before in recent years, the ACF cost has relatively higher ratio in manufacture cost. The conventional long bar ACF cutting unit is changed to short bar ACF cutting unit in new bonding technology. However, the new type machine was not optimized in process and mechanical design. Therefore, the failure rate of new ACF cutting process is much higher than the one of the conventional process. This wastes the material and rework cost is considerably large. How to make the manufacturing cost down effectively and promote the product quality is the concern issue to maintain competition capability for the product. Therefore, the Orthogonal Particle Swarm Optimization is used to analyze the optimal design problem. The ACF cutting yield rate is selected to be objective function for optimization. The quality characteristic function is used in Orthogonal Particle Swarm Optimization. The plasma clean speed, ACF peeling speed and ACF cutter spring setting are selected to study the effect of the yield rate. Results show that the proposed method can provide good solution to improve the ACF cutting process for TFTLCD.

• Periodical: Applied Mechanics and Materials (Volumes 479-480)
• Pages: 353-359
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.479-480.353
• Online since: December 2013
• Authors: Jian Long Kuo, Chung Hao Hsieh
• Keywords: ACF Cutting Process, Orthogonal Particle Swarm Optimization, Plasma Clean, Response Surface Method (RSM), TFT-LCD

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