The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging

Ming Shan Yang; Ran Yan; Yu Hong Yan; Yang Liu

doi:10.4028/www.scientific.net/AMM.509.15

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Preface and Organizing Committee

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Preparation and Rheological Characterization of Cross-Linked Dialdehyde Carboxymethyl Cellulose
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The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging
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The Status and Development of ECAP
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A Discrimination Method of Saturated Sand Liquefaction Possibility Based on Support Vector Machine
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Dragon Boat Straight Road Racing Rowing Technique Mechanical Movement Analysis
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 509The Curing Behavior of Organosilicone Materials...

The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging

Abstract:

The organosilicone gel material for large-power LED packaging was prepared through Si-H addition reaction of hydrogen-silicone with vinyl-silicone catalyzed by Pt coordination compound in this paper. The curing behavior was investigated by DSC method, and the curing dynamic parameters were obtained, i.e., the curing activation energy and reaction level of the system were 79.23kJ/mol and 0.8271 respectively, the initial curing temperature, maximum curing temperature and post-curing temperature were 75°C, 90°Cand 120°C, respectively, which supplied the basic data for the preparation and application of organosilicone materials for large-power LED packaging.

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Periodical:

Applied Mechanics and Materials (Volume 509)

Pages:

15-19

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.509.15

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Online since:

February 2014

Authors:

Ming Shan Yang*, Ran Yan, Yu Hong Yan, Yang Liu

Keywords:

Curing Behavior, Large-Power Light-Emitting Diode, Packaging, Silicone Gel Materials

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* - Corresponding Author

References

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