Research on Discharge Signals Feature Extraction of Sealing Packaging Food Existing Pinholes Based on EEMD

Abstract:

The issue of food safety is increasingly becoming the focus of social concerns, and breakage of packaging film is the main threat to the safety of sealing packaging food. For the small damage that is difficult to see with the naked eyes, according to that the impedance of damaged position is different from that of other position, the discharge signals of sealing packaging food in different damaged conditions are different in high voltage dielectric barrier discharge circuit, and then they are collected and analyzed. In order to solve the problem that different discharge signals are similar and characteristics are confused, wavelet packet and the EEMD method are novelly used to analyze discharge signals and the characteristic parameters of sealing packaging food that is intact or has pinholes are successfully extracted. This method solves the problem that the tiny damage is difficult to identify and detect, and it also provides a new train of thought for online test of sealing packaging food.

• Periodical: Applied Mechanics and Materials (Volumes 511-512)
• Pages: 361-365
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.511-512.361
• Online since: February 2014
• Authors: Qian Zhang*, Shan Geng Zhang, Yue Ma
• Keywords: Ensemble Empirical Mode Decomposition (EEMD), Feature Extraction, Signal De-Noising, Wavelet Packet

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