Modeling of Electrostatic Chuck and Simulation of Electrostatic Force

Abstract:

Electrostatic chuck (ESC) is one of the key components in IC manufacturing process, which applies the principle of electrostatic adsorption to clamp the wafer on its surface. In such a system, electrostatic force is considered as one of the most important indicators. The method of modeling and simulation of electrostatic force by COMSOL software is proposed, and the accurateness is validated by comparing the results with those from reference. Then, the simulation of ESC in real manufacturing process is finished using the above method, which focuses on the effects of dielectric materials and voltage on electrostatic force. The research can offer references for the design of ESC, and it has significance to reduce experimental cost and improve the reliability of the equipment.

• Periodical: Applied Mechanics and Materials (Volumes 511-512)
• Pages: 588-594
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.511-512.588
• Online since: February 2014
• Authors: Xing Kuo Wang, Jia Cheng*, Ke Sheng Wang, Yi Yong Yang, Yu Chun Sun, Ming Lu Cao, Chuan Kun Han, Lin Hong Ji
• Keywords: COMSOL, Electrostatic Chuck (ESC), Electrostatic Force, Modeling, Simulation

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