Simulation and Analysis of Thermal Distribution in Compact Multi-Chip Module

Abstract:

One of the main failure mechanisms in semiconductor device is the thermal breakdown of compact multi-chip (CMC) module. In order to avoid the compact layout or location of the heating chips, the distribution of the chips on printed circuit board (PCB) should be optimized to decrease the thermal breakdown probability of device. Based on the finite element theory, we simulated the three-dimensional space thermal field distribution of two kinds of PCB that the same chips were layout in difference ways in this paper. By analyzing the simulation results, we can find that the maximum temperature of the optimized CMC layout will be decreased about one degree. The simulation method and the conclusion of this paper will have significance effect for CMC design and optimization.

• Periodical: Applied Mechanics and Materials (Volumes 513-517)
• Pages: 3111-3114
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.513-517.3111
• Online since: February 2014
• Authors: Hao Yang Cui*, Yong Peng Xu, Can Liu, Nai Yun Tang, Feng Hong Chu, Zhong Tang
• Keywords: Compact Multi-Chip, Finite Element Theory, Thermal Field Distribution

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