Analysis and Optimization for Lead-Free Reflow Soldering Process Parameters of SMA Based on 6 σ Method

Xuan Jun Dai; Hong Yan Huang

doi:10.4028/www.scientific.net/AMM.602-605.180

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 602-605Analysis and Optimization for Lead-Free Reflow...

Analysis and Optimization for Lead-Free Reflow Soldering Process Parameters of SMA Based on 6 σ Method

Abstract:

The reflow soldering process under infrared hot air environment was simulated based on a typical BGA SMA and a twelve-zone reflow oven. Then the optimal soldering process parameters were obtained based on 6σ analysis method and related software. The results could be used to direct the lead-free soldering process parameters setting, and the soldering quality was ensured effectively.

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Periodical:

Applied Mechanics and Materials (Volumes 602-605)

Pages:

180-184

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.602-605.180

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Online since:

August 2014

Authors:

Xuan Jun Dai*, Hong Yan Huang

Keywords:

6 σ Method, Lead-Free Soldering, Process Parameter

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* - Corresponding Author

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