Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing

Zhi Xiang Liu; Jian Guo Yao; Song Zhan Fan; Jian Xiu Su

doi:10.4028/www.scientific.net/AMM.602-605.485

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 602-605Study on the Preparation Technology of Fixed...

Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing

Abstract:

According to the shortcomings of the traditional free abrasive chemical mechanical polishing (CMP), in recent years, the fixed abrasive chemical mechanical polishing (FA-CMP) technology is proposed. It is a new planarization technology developed on the basis of the traditional CMP. Pad is an important and dispensable part in FA-CMP. The cost and quality of FA-CMP pad are determined by the preparation technology. In order to study the FA-CMP pad of the low cost and high quality, in this paper, by reading a lot of literature, 5 kinds of preparation technology of FA-CMP pad are analyzed. Study results will provide some reference for further designing and manufacturing the FA-CMP pad.

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Periodical:

Applied Mechanics and Materials (Volumes 602-605)

Pages:

485-488

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.602-605.485

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Online since:

August 2014

Authors:

Zhi Xiang Liu*, Jian Guo Yao, Song Zhan Fan, Jian Xiu Su

Keywords:

Chemical Mechanical Polishing, Fixed Abrasive, Polishing Pad, Preparation Technology

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