Study on Si-Based LED Integrated Packaging with Vertical Structure

Mian Mian Guo; Ying Jiang; Qi Xin Wan; Zhi Hua Xiong

doi:10.4028/www.scientific.net/AMM.635-637.1151

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 635-637Study on Si-Based LED Integrated Packaging with...

Study on Si-Based LED Integrated Packaging with Vertical Structure

Abstract:

We study the influence on the luminous efficiency of Si-based LED with different chip spacing. It is found that the optimal chip spacing is 2mm. Furthermore, multi-chips LED with top and back electrodes, according to a certain permutations and combinations way, are packaged integrally on the independent silver reflective layers. We find the LED integrated package devices have higher driving voltage and lower driving current than traditional LED devices with top and back electrodes. In addition, our study shows that independent silver reflective layers can obtain a better luminous efficiency and thermal property.

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Periodical:

Applied Mechanics and Materials (Volumes 635-637)

Pages:

1151-1154

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.635-637.1151

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Online since:

September 2014

Authors:

Mian Mian Guo, Ying Jiang, Qi Xin Wan, Zhi Hua Xiong*

Keywords:

Chip Spacing, LED Chips with Vertical Electrode Structure, Luminous Efficiency, Silicon Substrate

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* - Corresponding Author

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