Influence of the Bonding Temperature on the Microstructure at the Cu/Al Interfacial Region

Abstract:

The Cu/Al composites are of vital importance in industrial applications due to their numerous advantages. The influence of the bonding temperature on the microstructure and morphology of the Cu/Al couples, fabricated using diffusion bonding method, is investigated in this paper. The interfacial morphology and constituent phases at the Cu/Al interface are analyzed by means of scanning electron microscopy equipped with energy dispersive X-ray spectroscopy. The results indicate that microstructural characteristics are associated with various bonding temperatures due to the accelerated inter-diffusion of atoms at higher temperature. The intermetallic layer is thicker with increasing the bonding temperature.

• Periodical: Applied Mechanics and Materials (Volumes 644-650)
• Pages: 4909-4913
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.644-650.4909
• Online since: September 2014
• Authors: Yan Qiu Han*, Li Hua Ben, Jin Jin Yao, Shu Wei Feng, Chun Jing Wu
• Keywords: Al, Cu, Diffusion Bonding, Interfacial Region, Intermetallic Compound

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