Considerations about the Role and Efficiency of the Transceiver's Heat Sink during Critical Situations

Arjana Davidescu; George G. Savii; Marius Mateas; Carmen Sticlaru

doi:10.4028/www.scientific.net/AMM.659.365

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 659Considerations about the Role and Efficiency of...

Considerations about the Role and Efficiency of the Transceiver's Heat Sink during Critical Situations

Abstract:

Thermal analysis of electronic equipment is becoming one of the primary aspects of many researches considering the trend line of reducing the size and increasing the speed. As the power of these systems increases and the space allotted to them decreases, heat flux or density becomes a critical factor in designing electronic equipment. The paper deals with thermal behavior of a particular heat sink designed for a VHF-UHF dual-band transceiver with a maximal power of 50 W. In this case, the electrical part generating this amount of power, is a MOSFET having a junction maximal temperature of 150 °C. A 3D CAD model was developed in proEngineer and finite element analyses were run in ANSYS in order to establish the best functioning conditions of the transceiver.

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Periodical:

Applied Mechanics and Materials (Volume 659)

Pages:

365-370

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.659.365

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Online since:

October 2014

Authors:

Arjana Davidescu*, George G. Savii, Marius Mateas, Carmen Sticlaru

Keywords:

Finite Element Method (FEM), Heat Sink, Thermal Analysis, Transceiver

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