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Tightness Simulation Analysis of Cooling Carrier in Three-Dimensional System in Package

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Abstract:

For the tightness problem of cooling carrier in high-power three-dimensional system in package, this paper analyzes the tightness problem. First, this paper makes modeling and simulation of cooling carrier in high-power three-dimensional system in package, makes thermal simulation analysis based on existing fluid boundary conditions using ANSYS, gets the temperature of each structure of the cooling carrier in high-power three-dimensional system in package, the fluid temperature, the fluid pressure and other results. Then, based on the results of the thermal simulation analysis as the boundary condition of structural analysis of cooling carrier, this paper gets the stress results at the seals, and analyzes the tightness problem of cooling carrier after the structure simulation. This paper provides a good reference on design of cooling carrier in high-power three-dimensional system in package.

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Periodical:

Applied Mechanics and Materials (Volume 685)

Pages:

173-177

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.685.173

Citation:

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Online since:

October 2014

Authors:

Wei Yuan Guo, De Jian Zhou, Hong Yan Huang

Keywords:

Cooling Carrier, Simulation, System in Package, Three-Dimensional, Tightness

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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References

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