Curing Behavior for Microencapsulated Curing Agents on Epoxy Resin Systems

Xi Wang

doi:10.4028/www.scientific.net/AMM.737.150

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 737Curing Behavior for Microencapsulated Curing...

Curing Behavior for Microencapsulated Curing Agents on Epoxy Resin Systems

Abstract:

Microcapsules containing a curing agent, 2-phenyl imidazole (2PZ), for a diglycidyl ether of bisphenol A (DGEBA) epoxy resin were prepared by a solid-in-oil-inwater emulsion solvent evaporation technique with poly (methyl methacrylate) (PMMA) as a polymeric wall. The former could take more than 3 months at room temperature, whereas the latter was cured after only a week. The values of the reaction order (a curing kinetic parameter) for DGEBA/2PZ and DGEBA/2PZ–PMMA microcapsules were quite close, and this showed that the curing reactions of the two samples proceeded conformably. The curing mechanism was investigated, and a two-step initiation mechanism was considered: the first was assigned to adduct formation, whereas the second was due to alkoxide-initiated polymerization.

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Applied Mechanics and Materials (Volume 737)

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150-153

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.737.150

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Online since:

March 2015

Authors:

Xi Wang*

Keywords:

Curing Behavior, Curing of Polymers, Microencapsulation

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