Anode Dissolution Localization of Copper in Water Electrolytes

Abstract:

This article is devoted to investigating a possibility of using electrochemical machining (ECM) technology in manufacturing of printed circuits. Some investigations into the anodic dissolution of copper in aqueous electrolytes under stationary conditions were conducted. The analysis of potentiodynamic polarization curve character allowed revealing both areas of active and passive copper dissolution as well as areas of only active and only passive dissolution. Electrolytes were identified and the concentration of electrolyte solutions where the dissolution process occurs in the above areas was determined. It is shown how to assess a degree of the ECM process localization in electrolytes with surface activation in the treatment area. A simplified function of the localization degree L = i ₀ /i without regard for current efficiency was used in the research. Electrolytes with a high degree of electrochemical dissolution localization were revealed. Potential ranges for each of the electrolytes providing a maximum degree of the localization copper dissolution process localization were determined.

• Periodical: Applied Mechanics and Materials (Volume 788)
• Pages: 11-16
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.788.11
• Online since: August 2015
• Authors: Boris A. Krasilnikov, Svetlana I. Vasilevskaya
• Keywords: Active Area, Copper, Degree of Localization, Electrochemical Dissolution, Lateral Etching, Localization of Process, Passive Area, Surface Activation

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