Fabrication of Functional Gradient Materials Electrode and its Application in Micro-EDM

Abstract:

The concept and the primary preparation method of functional gradient materials are described in this paper. Functional gradient material is prepared as a tool electrode by electrochemical method and its performance is further tested in the micro electrical discharge machining (micro-EDM) experiments. Compared with the homogeneous material electrode, the functional gradient material electrode can effectively inhibit the wearing of the tool electrode and improve the distribution trend of current density during the micro-EDM process. The results disclose the prospects for functional gradient material to be used as tool electrode in the micro-EDM process.

• Periodical: Applied Mechanics and Materials (Volume 868)
• Pages: 151-157
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.868.151
• Online since: July 2017
• Authors: Xiao Peng Li*, Yuan Gang Wang, Fu Ling Zhao, Meng Hua Wu
• Keywords: Composite Electrodeposition, Functional Gradient Material, Micro-EDM

References

[1] N. Cherradi, A. Kawasaki, M. Gasik, Worldwide trends in functional gradient materials research and development, J. Sci. Composites Engineering. 4(8) (1994) 883-894.

DOI: 10.1016/s0961-9526(09)80012-9

[2] E. Autissier, M. Richou, F. Bernard, et al, Design optimization of plasma facing component with functional gradient material Cu/W interlayer, J. Sci. Fusion Engineering And Design. 88(9–10) (2013)1714-1717.

DOI: 10.1016/j.fusengdes.2013.04.042

[3] P. Sebastián, E. Vallés, E. Gómez, Copper electrodeposition in a deep eutectic solvent. First stages analysis considering Cu(I) stabilization in chloride media, J. Sci. Electrochimica Acta. 123(5) (2014)285-295.

DOI: 10.1016/j.electacta.2014.01.062

[4] J.M. Park, K. Jin, B. Han, et al, Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition, J. Sci. Thin Solid Films. 556(5) (2014) 434-439.

DOI: 10.1016/j.tsf.2014.01.034

[5] M. Eslami, H. Saghafian, F. Golestani-fard, et al, Effect of electrodeposition conditions on the properties of Cu–Si3N4 composite coatings, J. Sci. Applied Surface Science. 300(5) (2014)129-140.

DOI: 10.1016/j.apsusc.2014.02.021

[6] Z. Y. Yu, T. Masuzawa, M. Fujino, Micro-EDM for three-dimensional cavities – development of uniform wear method. Annals of the CIRP, 47(1) (1998)169-172.

DOI: 10.1016/s0007-8506(07)62810-8

[7] W. Chen, X. M. Kang, L. Gu, et al, Research on electrically conductive CVD diamond as electrodes in micro and fine EDM, J. Machinery, 33(4) (2006) 26-28.

[8] D. M. Guo, M. Zhang, Z. J. Jin, Particle strengthening of the surface of copper electrode for electrical discharge machining. in: International Conference on Surface Finishing Technology and Surface Engineering Dailan, CHINA: FRONTIERS DESIGN MANUFACTURING (2006).

[9] Y.G. Wang. F. L. Zhao, J. Wang., Wear-resist Electrodes for Micro-EDM, J. Sci. Chinese Journal of Aeronautics. 22(3) (2009) 339-342.

DOI: 10.1016/s1000-9361(08)60108-9

[10] F. F. Xia, M. H. Wu, F. Wang, et al, Nanocomposite Ni–TiN coatings prepared by ultrasonic electrodeposition, J. Sci. Current Applied Physics. 9(1) (2009) 44-47.

DOI: 10.1016/j.cap.2007.11.014

[11] X. P. Li, Y.G. Wang, F. L. Zhao, et al , Influence of high frequency pulse on electrode wear in micro-EDM, J. Defence Technology. 10(3) (2014) 316-320.

DOI: 10.1016/j.dt.2014.07.007