Influence of Testing Temperature on the Weibull Modulus of Post-Hipped α-SiC

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Periodical:

Edited by:

M. Zahir

Pages:

249-256

DOI:

10.4028/www.scientific.net/AMR.1-2.249

Citation:

F. Osterstock and A. Charif, "Influence of Testing Temperature on the Weibull Modulus of Post-Hipped α-SiC ", Advanced Materials Research, Vols. 1-2, pp. 249-256, 1994

Online since:

September 1994

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