Study on Surface Quality and Machining Efficiency of Diamond Wire Saw Slicing SiCp-Al Composites

Chun Yan Zhang; Wu Yang; Yuan Sun

doi:10.4028/www.scientific.net/AMR.1004-1005.1295

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 1004-1005Study on Surface Quality and Machining Efficiency...

Study on Surface Quality and Machining Efficiency of Diamond Wire Saw Slicing SiCp-Al Composites

Abstract:

In order to study the basic rule of diamond wire saw slicing SiCp-Al composites, the theoretical analysis and experiments were carried out. The influences of diamond wire saw slicing speed and workpiece feed speed on surface quality and machining efficiency were discussed. The analysis results show that the machined surface gets smoother when diamond wire saw slicing speed changes from 2m/s to 3.5m/s, but gets rougher when diamond wire saw slicing speed changes from 3.5m/s to 4m/s. And the surface gets rougher when workpiece feed speed changes from 0.5m/s to 1m/s.The machining efficiency gets higher when diamond wire saw slicing speed and workpiece feed speed increase. These results provide guidance for selecting reasonable parameters in future research.

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Periodical:

Advanced Materials Research (Volumes 1004-1005)

Pages:

1295-1298

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1004-1005.1295

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Online since:

August 2014

Authors:

Chun Yan Zhang, Wu Yang, Yuan Sun

Keywords:

Diamond Wire Saw, Machining Efficiency, SiCp-Al Composite, Surface Quality

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