Effects of Compound Treatment of Pulsed Magnetic Field and Mechanical Vibration on Solidified Structure of Mg97Y2Cu1 Alloy

Article Preview

Abstract:

The influences of different pulse voltage, pulse frequency, pouring temperature and mold temperature on solidified structure of Mg97Y2Cu1 alloy reinforced by long-period ordered structure with compound treatment of pulsed magnetic field and mechanical vibration were studied. The results show that grains of the alloy can be refined greatly with compound treatment. Primary phase degrades from developed dendrites into rosette-shaped crystal. Distribution of second phase is more uniform and continuous, and its volume fraction increases. When the pulse voltage is at 0-280V or the pulse frequency is at 1-10Hz, grain size of the alloy decreases dramatically as pulse voltage or pulse frequency increases. When the pouring temperature is at 660-750°C or the mold temperature is at 20-600 oC, grain size of the alloy with compound treatment decreases grossly with the increase of the pouring temperature or the mold temperature.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 1061-1062)

Pages:

17-22

Citation:

Online since:

December 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2015 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] L.B. Mordike and T. Ebert: Materials Science and Engineering Vol. 302(2001), pp.37-45.

Google Scholar

[2] S. Schumann: Materials Science Forum Vol. 488(2005), pp.1-8.

Google Scholar

[3] X.F. Tian, Z.T. Fan and N.Y. Huang: The Chinese Journal Nonferrous Metals. Vol. 16(2006), pp.1838-1844(In Chinese).

Google Scholar

[4] Y.J. Xu, Y.Q. Su and L.S. Luo: Rare Metal Material and Engineering. Vol. 41(2012), pp.548-553(In Chinese).

Google Scholar

[5] H. Fu and Q. Zhou: Special Casting & Nonferrous Alloys. Vol. 33(2013), pp.1066-1070(In Chinese).

Google Scholar

[6] J. Li, Z.T. Zhang and T. Shi: Foundry Vol. 58(2009), pp.681-689(In Chinese).

Google Scholar

[7] J. Wang and P.J. Li:International Aluminum Profile Technology Seminar& Exposition Vol. 7(2007), pp.61-66.

Google Scholar

[8] M. Yoshiki , O. Yoshinor and M. Kenji: Materials Transactions. Vol. 45(2004), p.1994-(1998).

Google Scholar

[9] X.H. Xie, L.P. Chen, C.B. Xiao and X. Tang: Advanced Materials Research Vol. 842(2014), pp.332-336.

Google Scholar

[10] X.H. Xie, L.P. Chen, C.B. Xiao and X. Tang: Advanced Materials Research Vol. 821 (2013), pp.877-882.

Google Scholar

[11] B. Wang, Y.S. Yang and M.L. Sun: Trans. Nonferrous Met. Soc. China Vol. 20(2012), P. 1685-1690 (In Chinese ).

Google Scholar